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HOREXS GROUP
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big capacity of memory packaging substrate manufacture

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City: Shenzhen
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big capacity of memory packaging substrate manufacture

big capacity of memory packaging substrate manufacture

Application:Flash memory pacakge,NAND memory substrate package,Memory electronics,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:0.1mm; Material ...

Product Tags:

SYTech BT SD Card PCB Board

      

Fast Turn SD Card PCB

      

0.1mm SD Card PCB

      
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