Sip package substrate BT material 4 layer ENEPIG

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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Sip package substrate BT material 4 layer ENEPIG

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Sip package substrate BT material 4 layer ENEPIG

Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; ...

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