Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

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Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...

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Horexs FR4 Pcb

Ultra Thin FR4 Pcb For Encapsulation

Memory Card Ultra Thin FR4 Pcb

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