BGA IC Package Substrate With Cap Plated MGC BT material

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

Country/Region: China

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BGA IC Package Substrate With Cap Plated MGC BT material

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BGA IC Package Substrate With Cap Plated MGC BT material

Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of ...

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BGA IC Package Substrate

IC Package Substrate With Cap Plated

Horexs Printed Circuit Board

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