High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR

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High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR

PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile ...

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Green CSP package substrate

BT CSP package substrate

BT PBGA package substrate

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